As AI adoption accelerates, the thermal design power (TDP) of rack-mounted AI servers is growing exponentially. By 2025, liquid cold plate cooling has become the mainstream solution for effective heat dissipation. With years of expertise in welding and manufacturing, we provide a full range of high-performance cold plate solutions to meet diverse customer requirements, including: Monolithic Friction Stir Welded Cold Plates, Modular Cold Plates,
Embedded-Tube Cold Plates. Our precision-engineered cooling technologies are designed to support the next generation of AI computing, delivering superior thermal performance, energy efficiency, and reliability.