Exhibition Invitation | SEMICON 2025

Exhibition Details

• Date: Sep. 10th-12th, 2025

• Location: Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2)

• Booth No.: X0021

Featured Products

• Cooling Plates – High-precision CNC channel machining for superior thermal performance.

• FSW Water-Cooled Target Backplates – Friction Stir Welding technology ensuring pore-free, high-strength joints.

• Vacuum Valve Bodies – Precision-engineered for demanding high-vacuum semiconductor applications.

• Shower Heads – Optimized uniform gas distribution for enhanced thin-film deposition quality.

We Invite You!

We warmly welcome you to visit our booth, explore our cutting-edge technologies, and discuss potential collaborations.
🎁 Exclusive Gift for Visitors – Receive a small souvenir when you stop by our booth!